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Equipment Engineering Manager(Die Attach&wire Bond)

2 weeks ago

Jakarta, Indonesia Micron Semiconductor Asia Operations Pte. Ltd Full time

**Our vision is to transform how the world uses information to enrich life for all.**
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.JR28176 Equipment Engineering Manager(Die Attach&Wire Bond )

Lead a team of equipment/maintenance engineers & technicians to support production line in achieving Delivery, Quality, Cycle Time & Equipment Improvement goals.

Responsibilities and Tasks:

- Implement Preventive/Predictive maintenance program
- Scheduling and overseeing all maintenance-related work for machinery and equipment, facilities, office building.
- Review and evaluate maintenance operations.
- Ensuring that all maintenance operations are done in accordance with company policy and OSHA guidelines.
- Schedule both internal and external work(s) maximizing planned down time and reducing unplanned downtime.
- Optimize equipment according to standard procedure, enhancing performance and product quality, ensuring the achievement of all Key Performance Indicators (KPIs)
- Maintain & improve machine efficiency levels.
- Prepare the annual Maintenance budget and forecasts.
- Initiate spare parts management and second sourcing.
- Improvise maintenance operations to save on costs and work time.
- Implement best practices, standards and procedures in all maintenance functionalities.
- Guide and organize the writing of Maintenance SOP's (Standard Operating Procedures), WI's (Working instructions).
- Developing and implementing a (proactive) maintenance program.
- Initiate new methods/tools/assets to improve productivity and cut costs.
- Manage and lead the team, ensuring adequate staffing levels & build up a well-operated maintenance team.
- Work with Package Development team to establish production capabilities for new products

**Requirements**:

- Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering
- Minimum 3 years of working experience in semiconductor industry.
- Knowledge inDie Attach, Devoid/oven curing, Wire Bond, Plasma Cleaning, Flip Chip, Underfill& SMT will be added advantages.
- Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team.
- Broad technical knowledge in problem solving analytical skill & lead an engineering team through innovative process implementation (FMEA, DOE, FDC/APC, DATA ANALYSIS)
- Self-motivated, possess initiative and ability to work independently
- Team player with good communication and interpersonal skills

**About Micron Technology, Inc.**
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.